Description

Minimum qualifications:

• Bachelor's degree in Manufacturing, Mechanical, Electrical Engineering, or equivalent practical experience.
• 10 years of experience in electroless and electrolytic copper plating.
  
• 10 years of experience in the sequential lamination process including microvia formation, laser/mechanical drilling, and laser energy.
  
• 10 years of experience with PCB copper, glass and dielectrics beyond standard FR-4, including high-speed/low-loss materials (e.g., Rogers, Megtron, Tachyon), resins, and polyamides.
• 10 years of experience in interconnect PCB (multi-lam and LFF HDI) design and manufacturing processes development.

Preferred qualifications:

• Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
  
• 12 years of experience in manufacturing, quality, or product engineering for hardware technology and systems.
• Experience in technical leadership, project management, and executive communication.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

The AI and Infrastructure team is redefining what's possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $171,000-$248,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.


Responsibilities

• Serve as the subject matter expert on PCB fabrication processes and laminate materials to deliver advanced PCB fabrication and design strategies.
  
• 
  Influence product designs with stack-ups and design for manufacturability guidance and ensure the development and scale of novel, high-yield production processes.
  
• 
  Lead the development of novel PCB manufacturing techniques to enable Google's product roadmap. Review layer stack-ups and PCB designs, match supplier technology/capability to product complexity, identify technology/capability gaps.
  
• 
  Lead experimental validation for novel technologies, materials, and processes, through formal Designs of Experiments to systematically identify and establish scalable manufacturing processes for advanced PCB technologies.
  
• Work with Supplier Quality Engineering team to improve fabrication yield by leading root cause analysis on board defects like delamination or via opens, using failure analysis and statistical tools to implement supplier corrective actions.

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Requisition #: 133950734533042886

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