Description

Minimum qualifications:

• Bachelor's degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field and 10 years of progressive post-baccalaureate experience in the job offered or in a Silicon Product Engineering-related occupation.
• Alternatively, will accept a Master's degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field, and 8 years of experience in the job offered or in a Silicon Product Engineering-related occupation.
• Position requires 8 years of experience in the following:
  
  • Advanced Packaging Process Development & HVM Qualification such as for Mobile SOC or SiP (System in Package)
  • IC Packaging Failure Mode and Effects Analysis (FMEA), Design of Experiment techniques (DOE) and Statistical Process Control (SPC)
  • Chip-Package Interaction(CPI) evaluation, Electromigration (EM) Analysis, Package component & board level reliability testing
  • Failure Analysis and Root Cause Corrective Action for IC Packaging
  • Technical engagement and program execution with all packaging ecosystem partners including OSATs, substrate manufacturers, and material/machine suppliers.
  
  

About the job
Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.

The US base salary range for this full-time position is $176,150 - $237,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

The Platforms and Devices team encompasses Google's various computing software platforms across environments (desktop, mobile, applications), as well as our first party devices and services that combine the best of Google AI, software, and hardware. Teams across this area research, design, and develop new technologies to make our user's interaction with computing faster and more seamless, building innovative experiences for our users around the world.


Responsibilities

• Define, develop, and optimize high-volume manufacturing (HVM) processes for advanced semiconductor packaging technologies for consumer devices, ensuring compliance with electrical, thermal, mechanical, environmental, and cost requirements, especially mobile SOC SIP for on-device AI.
• Drive process optimization and yield improvement using Design of Experiments (DOE) methodology, and establish rigorous process monitoring and control systems to ensure robust manufacturing. Establish and evaluate the effects of package assembly and bumping processes, specifically assessing Chip Package Interaction (CPI) effects such as Silicon ELK stress and impact on board-level reliability.
• Lead Electromigration (EM) evaluations for fine-pitch package solutions, defining material and process requirements to meet long-term package development and reliability roadmaps. Perform comprehensive failure analysis and root cause resolution for manufacturing and field issues encountered during both the technology development and mass production phases.
• Collaborate and manage key suppliers, including OSATs, substrate vendors, and packaging ecosystem partners, to drive technology roadmap execution and establish internal packaging.
• Domestic and International travel required.

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Requisition #: 136511590529671878

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