Description

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Industrial/Manufacturing Engineering, or Mechanical Engineering, or equivalent practical experience.
• 8 years of experience in manufacturing.

Preferred qualifications:

• Bachelor's degree in Manufacturing, Mechanical, Electrical Engineering, or equivalent practical experience.
• 8 years of experience in the sequential lamination and build-up process including microvia formation, laser/mechanical drilling, and laser energy.
• 8 years of experience in electroless and electrolytic copper plating.
• 8 years of experience with PCB copper, glass and dielectrics beyond standard FR-4, including high-speed/low-loss materials (e.g., Rogers, Megtron, Tachyon), resins, and polyamides.
• 8 years of experience in PCB stack-up development and design for manufacturing.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As an Advanced Staff Manufacturing Engineer for the New Technology Introduction process, you will be an integral part of the Cloud Supply Chain Operations team. You will be responsible for releasing Google's hardware to mass production and developing a supply chain to deliver it. The core responsibility begins with leading the development and scale of new Printed Circuit Board (PCB) manufacturing and materials technologies to enable the growing roadmap of Google Cloud data center products. You will be the technical expert for advanced PCB manufacturing processes and provide technical leadership for the delivery of approaches and processes for our product development efforts.

In this role, you will work cross-functionally to influence technology direction and adoption for our data center products. You will also ensure that our supply chain stack is fully readied to execute novel manufacturing and test approaches in production environments.

The AI and Infrastructure team is redefining what's possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

The US base salary range for this full-time position is $144,000-$209,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.


Responsibilities

• Serve as the subject matter expert on PCB fabrication processes and laminate materials to deliver advanced PCB fabrication and design strategies. Influence product designs with stack-ups and design for manufacturability guidance and ensure the development and scale of novel, high-yield production processes.
• Propose stack-ups and PCB designs including choices of laminate, match supplier technology/capability to product complexity, identify technology/capability gaps.
• Perform PCB design for manufacturing per guidelines, suggest and establish scalable manufacturing processes for advanced PCB technologies.
• Work with Supplier Quality Engineering team to improve fabrication yield by leading root cause analysis on board defects like delamination or via opens, using failure analysis and statistical tools to implement supplier corrective actions.

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Requisition #: 126840863924855494

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