Description

Job Details:

Job Description:

The Role and Impact

As a Product Packaging Engineer, you will play a key role in developing Intel's next-generation packaging solutions for semiconductor and electronic products. In this role, you will contribute to the design, development, qualification, and optimization of packaging technologies that support product performance, manufacturability, scalability, and sustainability.

Working closely with cross-functional teams across engineering, manufacturing, supply chain, and quality organizations, you will help drive innovative packaging solutions that enable Intel to remain a leader in advanced semiconductor technology. This position offers the opportunity to combine technical expertise, problem-solving, and innovation to deliver impactful solutions on a global scale.

Key Responsibilities

• Design, develop, and qualify packaging materials and solutions for semiconductor and electronic products.
• Lead packaging development activities from concept and prototyping through qualification testing and manufacturing implementation.
• Collaborate with cross-functional teams to ensure alignment with manufacturing, supply chain, logistics, quality, and regulatory requirements.
• Develop and maintain packaging specifications, artwork, documentation, and bills of material (BOMs).
• Drive process improvements focused on manufacturability, cost optimization, waste reduction, and sustainability initiatives.
• Analyze thermal, mechanical, and electrical performance of packaging designs to ensure product reliability and compliance with specifications.
• Troubleshoot packaging-related issues and develop innovative technical solutions for internal stakeholders and customers.
• Establish and manage material specifications for suppliers and work closely with Quality Assurance and Procurement teams to ensure compliance with quality standards and vendor performance expectations.
• Benchmark industry trends, emerging technologies, and best practices to identify opportunities for innovation and continuous improvement in packaging technologies.

Qualifications:

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Electrical Engineering, Physics, Chemistry, Optical Engineering, Polymer Science and Engineering, or a related technical field.
• 1+ years of relevant engineering experience with a Bachelor's degree; OR a Master's degree or PhD in Engineering or a related discipline with no prior experience required.

Preferred Qualifications:

• Proficiency in applying fundamental science and engineering concepts to develop innovative packaging solutions.
• Demonstrated experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Experience in semiconductor manufacturing and/or advanced packaging technologies.
• Experience with packaging process development, assembly equipment, or manufacturing optimization.
• Knowledge of reliability testing, failure analysis, and process qualification methods.
• Experience working in high-volume manufacturing or technology development environments.
• Strong collaboration and communication skills with cross-functional teams and external suppliers.

Join Intel's dynamic team and contribute to the future of semiconductor technology. Apply now to be part of our mission to redefine what's possible in the world of packaging engineering.

Job Type:
College Grad

Shift:
Shift 1 (United States of America)

Primary Location:
US, Oregon, Hillsboro

Additional Locations:
US, Arizona, Phoenix

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust
N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $105,650.00-172,860.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Requisition #: JR0284321

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