Description

Job Details:

Job Description:

The Advanced Design Customer Enabling (ADCE) group operates within Intel's Assembly Packaging Technology manufacturing organization (APTM). The ADCE Packaging Design Architect works with silicon, package, and board design teams to define and implement strategies that optimize product performance and cost. This involves technical leadership in advanced packaging technologies, such as silicon bridges or interposers.

Responsibilities:

• Drives end-to-end development for substrate design from concept through tapeout and implements physical layout and routing of the package design.
• Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs.
• Works closely with silicon and hardware teams to optimize silicon package board performance and pinout.
• Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design.
• Completes documentation and collateral into the product lifecycle management system of record.

Required Skills and Experience:

• Strong technical background in design and electrical analysis.
• Solid background in semiconductor fabrication and packaging
• Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
• Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.
• Ability to work independently and at various levels of abstraction
• Strong organization, time management, and communication skills, self-motivated.

Preferred Skills and Experience:

• Experience and knowledge with assembly process, test and characterization techniques would be an added advantage

Qualifications:

• Ph.D. or master's in electrical engineering, chemical engineering, mechanical engineering or material science.
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Arizona, Phoenix

Additional Locations:
US, Oregon, Hillsboro

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $256,050.00-361,480.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Requisition #: JR0282973

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