Description

Job Details:

Job Description:

About This Opportunity

Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions.

WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements.

WCS is committed to advancing wireless communication capabilities, supporting Intel's leadership in the wireless ecosystem, and enabling next-generation connected experiences.

As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.

What You'll Do

Strategic Leadership & Architecture:

• Translate product requirements into comprehensive package architecture specifications
• Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards
• Lead Package level simulations (Mechanical and Thermal) to address specific risk areas
• Define overall product package performance specifications and drive technology certification
• Oversee end-to-end package development processes, from design through production

Technical Excellence & Innovation:

• Troubleshoot complex packaging problems and develop innovative, cost-effective solutions
• Research packaging assembly materials and properties, establishing specifications for suppliers
• Perform mechanical and reliability simulations to optimize package design
• Conduct thermal performance simulations using predictive FEA analysis

Cross-Functional Collaboration:

• Partner with silicon, hardware, and package design teams to ensure high-quality deliverables
• Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers
• Support product co-design and layout teams as manufacturing liaison
• Collaborate with Quality & Reliability teams to ensure products meet specifications
• Complete DFMEA assessments with assembly suppliers to evaluate technology risks

Manufacturing & Process Management:

• Ensure seamless transition from design to high-volume production
• Design and validate Test Vehicles for process characterization
• Provide consultation on packaging improvements and process optimization

Qualifications:

What We're Looking For

Education & Experience

Minimum Requirements:

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience
• OR Master's degree in relevant field + 3+ years experience
• OR PhD in relevant field + 1+ years experience

Required Technical Skills

• 2+ years package assembly technology development experience
• 2+ years packaging physics (mechanical and thermal) and/or materials experience
• 2+ years package assembly manufacturing processes and HVM ramp experience

Preferred Qualifications

• Semiconductor device physics and process engineering experience
• RF Component Packaging experience (highly valued for wireless products)
• Testing systems experience with hardware/software (Matlab, LabView)

Essential Skills

• Strong project management capabilities
• Proficiency in Microsoft Office Suite
• Excellent communication and presentation abilities
• Self-driven with strong problem-solving tenacity
• Action-oriented mindset

Why This Role Matters

You'll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Oregon, Hillsboro

Additional Locations:

Business group:
Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust
N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Requisition #: JR0282295

pca3lyuhf