Description

Minimum qualifications:

• Bachelor's degree in Computer Science, Electrical Engineering, Physics, or a related field, or equivalent practical experience.
• 4 years of experience working in semiconductor process development and integration, or 3 years of experience with an advanced degree.

Preferred qualifications:

• PhD degree in Electrical Engineering, Chemical Engineering, Physics, Chemistry, Material Science, or a related field.

About the jobAs a Process Integration Engineer, you will collaborate with Engineering teams and lead projects to develop, troubleshoot, and implement thin film processes for micro-Light-Emitting-Diode (LED) display fabrication with initiative and problem-solving in a clean room wafer fab environment. You will focus on development and troubleshooting of thin film process modules, design and execution of experiments, and analysis of experiment results.Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

The US base salary range for this full-time position is $159,000-$233,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Develop and troubleshoot wafer fabrication process modules in a clean-room wafer fab.
• Lead projects by working closely with device and process engineers to explore, develop, troubleshoot, characterize, and validate unit processes and process steps.
• Drive the characterization of thin film materials in collaboration with the Failure Analysis team.
• Find a path for critical new thin film processes, including demonstration of feasibility, tool specifications, vendor evaluations, and tool qualifications.

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Requisition #: 92650162047853254

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