Description

Minimum qualifications:

• Bachelor's degree in Mechanical or Industrial Engineering, a related discipline, or equivalent practical experience.
• 10 years of experience in mission critical facility design and construction environments.
  
• 8 years of experience in custom mechanical equipment design, with experience in data center server hall infrastructure cooling components and adiabatic cooling systems.
• 8 years of experience in thermal analysis and the optimization of data center cooling systems, including experience with water and energy calculations.
• 8 years of experience with analytical and modeling tools such as 6Sigma, AFT Fathom, Python, and Sheets for system analysis and design.

Preferred qualifications:

• Master's degree in Mechanical Engineering or a Professional Engineering (PE) license.
  
• Experience with engineering team management.
• Experience in applying data center technologies.
• Proficiency with SQL, C , and Pipe Stress Analysis.

About the job
Our thirst for technology is a part of everything we do. The Data Center Engineering team takes the physical design of our data centers into the future. Our lab mirrors a research and development department -- cutting-edge strategies are born, tested and tested again. Along with a team of great minds, you take on complex topics like how we use power or how to run state-of-the-art, environmentally-friendly facilities. You're a visionary who optimizes for efficiencies and never stops seeking improvements -- even small changes that can make a huge impact. You generate ideas, communicate recommendations to senior-level executives and drive implementation alongside facilities technicians.

With your technical expertise, you ensure compliance with codes and standards, develop infrastructure improvements and serve as an expert in your specialty (e.g., cooling, electrical).

Google is transforming how hyperscale data centers are planned, designed, and built - from custom, stick-built, multi-year construction monoliths to productized, manufactured, modular, just-in-time deployments of fungible capacity.

In this role, you will develop liquid cooling solutions for our advanced accelerator roadmap. You will play a crucial role in driving the thermal performance and efficiency of our high-power computing systems. You'll work in a dynamic environment, collaborating with cross-functional teams to design, analyze, and optimize chip-to-chiller cooling systems.

Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.

The US base salary range for this full-time position is $171,000-$254,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Evaluate, design, and optimize liquid cooling components (e.g., cold plates, manifolds, heat exchangers, fancoils) and their seamless integration into accelerator designs, leveraging expertise in silicon packaging architectures.
• Conduct detailed Computational Fluid Dynamics (CFD) and pipe flow analysis (e.g., Applied Flow Technology (AFT) Fathom) for fluid flow, heat transfer, and pressure drop, optimizing designs for maximum thermal efficiency and reliability.
• Apply knowledge of data center cooling, Coolant Distribution Units (CDUs), and chip-to-chiller architectures to ensure system-level cooling design and hydronic optimization within the data center environment.
• Utilize product design principles for high-performance systems, focusing on Design Failure Mode and Effects Analysis (DFMEA) and Design for Manufacturability (DFM), while designing and executing experiments to validate thermal models and system performance.

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Requisition #: 133342803655566022

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