Description

Job Details:

Job Description:

Join Intel and build a better tomorrow. Our exciting vision: Extend computing technology to connect and enrich the lives of every person on earth. Join us as we create the next generation of technologies that will shape the future for decades to come.

The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. Within WPM, the fab module engineer role is multifaceted. The ideal candidate will have a passion for equipment and process optimization with the goal of developing a robust manufacturing process module.

You will be responsible for owning all aspects of one or more of our factory's 300mm toolsets in the segment responsible for thick metal/via layers, bumping, reflow, thinning, and backside metallization. Sustaining responsibilities will include safety, tool health and matching, process health and matching (process control systems), excursion prevention and response, and enabling a diverse range of product types to run efficiently through the line. You will work with partners in other geographies to ensure the factory network consistently and cohesively delivers high-quality, high-confidence products for our customers. You will be responsible for delivering Model of Record tool performance and drive continuous improvement toward tool availability, cycle time, defect density, and cost. Our organization supports the full process/product lifecycle for this segment, inclusive of early development, ramp readiness, ramp, and long-term high-volume manufacturing. Thus, your responsibilities may include elements of module-level development. Examples include defining roadmaps to meet process/product requirements, driving equipment configuration changes, designing and conducting experiments, materials development and selection, and characterization of defect modes and integrated issues/marginality with proposals to resolve them.

Module engineers must solve problems utilizing formal education, self-driven knowledge and upskilling, statistical knowledge, and effective problem-solving tools/methods. Additionally, engineers must build lasting capability for the module through training others; robust documentation; cogent analysis and presentation of data; thorough transfer to other sites; and hardening systems for safety, quality, output, and cost.

The ideal candidate will demonstrate the following traits:

• They are capable of working in a high-performing culture with high expectations, execution with urgency, and personal ownership.
• They are data-driven and are motivated to solve problems, independently and in a group setting, with high commitment to task.
• They thrive in a dynamic and ambiguous environment.
• They possess excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills.

Working with us is an opportunity to transform technology and create a better future. We foster a collaborative, supportive, and exciting work environment, where the brightest minds come together to achieve exceptional results. We offer competitive salary and financial benefits as well as programs that promote health and well-being. We strive for a more connected and intelligent future, and we are excited for you to join us in that mission.

Qualifications:

Candidates must possess the following minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor.

Minimum Qualifications:

• Bachelor's Degree in an Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering).
• 6+ years semiconductor Engineering (fab or OEM vendor) experience.

Preferred Qualifications:

• Advanced degree in related field (as above) or 10+ years semiconductor experience (as above) are highly desirable.
• Knowledge of statistics and experimental design and the skills to apply that knowledge to tool matching, tool qualification, and process development.
• Strong data analysis and presentation acumen.
• Strong technical and troubleshooting skills.
• Ability to work across organizational boundaries including module process engineering, manufacturing, integration and yield.
• Excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Oregon, Hillsboro

Additional Locations:

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust
N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Requisition #: JR0282698

pca3lyuhf