Description

Job Details:

Job Description:

Job Description:

Leads a team of thin film deposition engineers to drive technology development and enablement across multiple modules for advanced CMOS technologies.
Will be responsible for development and driving manufacturability across modules spanning different process types that may include chemical vapor deposition (CVD), Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), thermal / plasma based deposition, epi, furnace, implant, anneal and/or treatment processes .
Primary responsibilities will reside at the intersection of technology development and High Volume Manufacturing (HVM), especially on new deposition processes that require engineering to meet high volume requirements.
This includes driving safety, quality, performance, throughput, capability, lower defectivity, better uniformity and lower cost.
This organization will engage closely with teams in Technology Development (TD) as well as the high-volume manufacturing teams in the factories and will be part of the Manufacturing Development and Customer Engineering (MDCE) team.
This leader will set the goals for the team, manage the program deliverables, coach and develop the engineers while also developing an understanding of the future needs of the organization and will put in place an organizational strategy to meet the needs of Intel foundry technologies roadmap.
The leader will be a thin film deposition expert both from an equipment and process perspective and have experience working with Integration and other modules leaders such as etch and lithography to deliver modular solutions that meet the technology targets.

What we do:
As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing. This leader will lead a team that is responsible for delivering significant yield improvement, performance enhancement, and cost reduction for multiple technology nodes (including Intel 18A and Intel 3). This leader will partner successfully with multiple internal organizations and external suppliers in a highly visible role to meet Intel foundry customer needs on schedule.

What we offer:

• We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth.

• As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.

• We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).

• We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.

Benefits:
We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work. Find more information about our amazing benefits here.

The ideal candidate should exhibit behavioral traits that indicate:
We are looking for a results-oriented individual with strong technical acumen, problem-solving skills, multitasking ability, and attention to quality and detail. The ideal candidate will possess:

• Leadership and Trust: A high performer with a track record of significant accomplishments, strong leadership, resourcefulness, and the ability to manage extremely sensitive information.

• Competency, Performance: A high performer with a track record of significant accomplishments.

• Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.

• Technical and Business Acumen: A combination of technical capability, business acumen, and executive expertise to drive results across multiple groups and disciplines.

• Communication Skills: Excellent written and verbal communication skills, with the ability to interpret and present technical information clearly to various audiences.

• Initiative and Perseverance : Strong self-initiative, persistence, and the ability to navigate ambiguity and drive clarity in key areas.

• Detail Orientation: Ability to gather, analyze, and interpret data to drive results.

• Pressure Handling: Willingness to handle high degrees of task and deadline pressure in a dynamic environment while remaining focused.

• Industry Knowledge: Deep knowledge of technology development and manufacturing strategies, products, processes, fab structure, and transfer methodology. Demonstrated ability to understand and interpret industry trends, create and drive strategies, work independently, simultaneously manage diverse and extensive assignments while remaining organized and productive.

• Cultural Change: Demonstrated results in driving organizational culture change through workplace of choice efforts.

Job Responsibilities include but are not limited to:

• Strategic Alignment and Customer-first execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.

• Synthesis of diverse information: Ability to gather diverse inputs, uplevel to the right strategic response.

• Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing).

• Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.

• Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers . Establish strong working relationships.

• Industry Trends: Stay updated on relevant industry direction setting technologies.

• Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules

• Team management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.

• Work together, in person: Work together with team members in person to enable faster decision making and problem resolution.

Qualifications:

Minimum Qualifications:

• 14 years of relevant work experience in the semiconductor industry with a strong focus on thin film deposition.

• Masters Degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or Technical Equivalent

• 5+ years prior people management experience with large, multi-national manufacturing employers, preferably in high technology/scientific/semiconductor sectors with prior specialization in technology development.

• Strong history of industry experience in process development, leadership, and semiconductor process.

• Background working with a combination of investors and third- party suppliers on solution optimization/customization to meet their manufacturing needs especially with the industry leaders in thin film deposition processes such as AMAT, LAM and ASM.

• Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in High Volume Manufacturing environments.

• Extensive experience in fab start-up with technical track record in multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations.

Preferred Qualifications:

• A doctoral degree is a plus.

• Substantial technical background in thin-film deposition for advanced CMOS technologies, with a body of research and patents.

• Demonstrated history of delivering customized solutions in Research and Development and HVM organizations.

• Logic expertise in Gate All Around (GAA)

• Cross-functional leadership experience

• Previous related work experience in a semiconductor foundry is preferred.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Oregon, Hillsboro

Additional Locations:

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $211,400.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Requisition #: JR0280592

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