Description

ASIC Engineer Principal

This role has been designed as 'Hybrid' with an expectation that you will work on average 2 days per week from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today's complex world. Our culture thrives on finding new and better ways to accelerate what's next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description:

SoC Top-Level & block-level Physical Design Engineer

As a block-level and top-level SOC Physical Design Engineer, you will contribute to all phases of physical design from RTL to the delivery of our final GDSII. Your responsibilities include:

Responsibilities:

• Implement physical design at the large SoC chip level from RTL to GDSII, creating a design database ready for manufacturing.

• Interact with IP vendors to understand IP integration requirements and integrate all blocks, IPs, and sub - chips at a large SoC level.

• Collaborate with the packaging team on Microbump / Probe Bump/ Bump/Pad placement.

• Build full chip floorplan, including pads/ports/ b ump placement, block placement and optimization, block pins placement and alignment, power grid, and RDL design , etc.

• Develop the chip-level clock network and clock stations in collaboration with clock experts.

• Budget timing among blocks and sub - chips at the chip level, generating block/chip-level static timing constraints.

• Arrange, analyze, and optimize feedthrough and repeaters among all blocks/ sub - chips at the chip level.

• Perform block-level place and route, including custom place & route, ensuring the design meets timing, area, power constraints, and all sign-off criteria.

• Generate and implement ECOs to fix timing, signal integrity, EM/IR violations, PV, and complete formal verification.

• Integrate DFT into physical design, ensuring alignment with overall test strategies and manufacturing requirements.

• Run Physical Design verification flow at chip/block level, fixing LVS/DRC/ERC/ANT violations.

• Collaborate closely with architecture, frontend design, DV, and package teams to ensure cohesive design implementation and successful project tapeouts .

Minimum Qualifications:

Education:

• BS degree in electrical engineering, computer engineering, or a related field with 7+ years of experience in block or full-chip physical design, or

• MS degree in the above fields with 5+ years of related experience.

Technical Expertise:

• Deep design experience in large SoC designs, including IP integration, padring design, bump planning, and RDL routing strategy.

• Extensive knowledge and practices in Physical Design, including physically aware synthesis, floor-planning, place & route, CTS, and repeater/feedthrough.

• Experience in developing and implementing power-grid and clock network at chip level.

• Knowledge of basic SoC architecture and HDL languages like Verilog to work with the logic design team for timing fixes.

• Experience in physical design verification to debug LVS/DRC/ERC/ANT issues at chip/block level.

• Experience in custom place and route.

• Exposure to 2.5D/3D packaging is preferred.

• High performance and large chip design experience is preferred.

• Exposure to DFT is preferred.

• Proficiency in writing Linux shell scripts in Perl, TCL, and Python.

• Real chip tapeout experience in 7nm and/or below with a successful signoff track record .

• Self-motivated with strong problem-solving and debugging skills.

• Ability to work effectively in a dynamic group environment.

Additional Skills:

Accountability, Accountability, Action Planning, Active Learning, Active Listening, Agile Methodology, Agile Scrum Development, Analytical Thinking, Bias, Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data Analysis Management, Data Collection Management (Inactive), Data Controls, Design, Design Thinking, Empathy, Follow-Through, Group Problem Solving, Growth Mindset, Intellectual Curiosity (Inactive), Long Term Planning, Managing Ambiguity {+ 5 more}

What We Can Offer You:

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have - whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Let's Stay Connected:

Follow @HPECareers on Instagram to see the latest on people, culture and tech at HPE.

#unitedstates

Job:

Engineering
Job Level:

TCP_05

\"The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level.
- United States of America: Annual Salary USD 174,000 - 352,500 in California
The listed salary range reflects base salary. Variable incentives may also be offered.\"

Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together. Please click here: Equal Employment Opportunity .

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

No Fees Notice & Recruitment Fraud Disclaimer

It has come to HPE's attention that there has been an increase in recruitment fraud whereby scammer impersonate HPE or HPE-authorized recruiting agencies and offer fake employment opportunities to candidates. These scammers often seek to obtain personal information or money from candidates.

Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge any candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process. The credentials of any hiring agency that claims to be working with HPE for recruitment of talent should be verified by candidates and candidates shall be solely responsible to conduct such verification. Any candidate/individual who relies on the erroneous representations made by fraudulent employment agencies does so at their own risk, and HPE disclaims liability for any damages or claims that may result from any such communication.

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